Proprietary Wafr Technology
Wafr-developed thermal infrastructure for high-density computing and liquid-cooled environments.

Overview
Wafr designs and builds FRDGE for high-density, liquid-cooled compute environments, customized to project-specific heat loads.
Wafr FRDGE thermal infrastructure is engineered, built and tested to applicable CSA, ASHRAE and IEEE standards, supporting direct-to-chip and immersion cooling architectures.
Capacity
350 to 1,000 kW
Fluid Loop
Single or dual loop
Redundancy
N, N+1 or 2N

Configurations
Select the family or configuration that best matches the application. Final ratings and options are confirmed on a project basis.
Common FRDGE configurations:
Management prototype: sizes, ratings and lead-time indicators shown here are illustrative until confirmed in approved Wafr product documentation.
Engineering
Representative specification framework for Wafr's proprietary FRDGE thermal platform.
Structured so engineering and procurement teams can review key ranges quickly.
Thermal capacity
Project specific
Architecture
Modular
Redundancy
Configurable
Fluid loop
Application specific
Controls
Integrated
Deployment
Packaged / field integrated
Applications
AI / HPC / colo
Interface
Facility cooling loop

Flow diagrams, operating temperatures and redundancy logic are confirmed on a project basis.
Integration notes cover direct-to-chip and immersion cooling architectures.
Redundancy planning supports N, N+1 and 2N configurations depending on facility requirements.
Deployment options include packaged units and field-integrated builds.
Compliance
Applicable standards and supporting certification documents can be surfaced directly on each product page.
CSA
Applicable by configuration
UL / cUL
Applicable by configuration
IEEE
Applicable by configuration
ANSI
Applicable by configuration
NEMA
Applicable by configuration
QA Docs
Applicable by configuration